| Titre : | Advanced materials and technologies for micro/nano-devices, sensors and actuators | | Type de document : | texte imprimé | | Auteurs : | Evgeni Gusev, Auteur ; Eric Garfunkel, Auteur ; Arthur Dideikin, Auteur | | Editeur : | Dordrecht : Springer | | Année de publication : | 2010 | | Collection : | NATO Science for Peace and Security Series | | Importance : | 314 p. | | Présentation : | couv. ill. en coul. | | Format : | 24 cm. | | ISBN/ISSN/EAN : | 978-90-481-3806-7 | | Langues : | Anglais (eng) | | Catégories : | PHYSIQUE
| | Index. décimale : | 05-10 Physique des semi-conducteurs | | Résumé : | A NATO Advanced Research Workshop (ARW) entitled “Advanced Materials and Technologies for Micro/Nano Devices, Sensors and Actuators” was held in St. Petersburg, Russia, from June 29 to July 2, 2009. The main goal of the Workshop was to examine (at a fundamental level) the very complex scientific issues that pertain to the use of micro- and nano-electromechanical systems (MEMS and NEMS), devices and technologies in next generation commercial and defen- related applications. Micro- and nano-electromechanical systems represent rather broad and diverse technological areas, such as optical systems (micromirrors, waveguides, optical sensors, integrated subsystems), life sciences and lab equipment (micropumps, membranes, lab-on-chip, membranes, microfluidics), sensors (bio-sensors, chemical sensors, gas-phase sensors, sensors integrated with electronics) and RF applications for signal transmission (variable capacitors, tunable filters and antennas, switches, resonators). From a scientific viewpoint, this is a very multi-disciplinary field, including micro- and nano-mechanics (such as stresses in structural materials), electronic effects (e. g. charge transfer), general electrostatics, materials science, surface chemistry, interface science, (nano)tribology, and optics. It is obvious that in order to overcome the problems surrounding next-generation MEMS/NEMS devices and applications it is necessary to tackle them from different angles: theoreticians need to speak with mechanical engineers, and device engineers and modelers to listen to surface physicists. It was therefore one of the main objectives of the workshop to bring together a multidisciplinary team of distinguished researchers. | | Note de contenu : | Table of contents
MEMS/NEMS TECHNOLOGIES AND APPLICATIONS
History of Early Research on MEMS in Russia (U.S.S.R.)
Challenges of Complete CMOS/MEMS Systems Integration
MEMS for Practical Applications
Nanochip: A MEMS-Based Ultra-High Data Density Memory Device
Low Cost Silicon Coriolis’ Gyroscope Paves the Way to Consumer IMU
Microwave and Millimetre Wave Devices Based on Micromachining of III-V Semiconductors
Monocrystalline-Silicon Microwave MEMS Devices
Three-Dimensional Photonic Crystals Based on Opal-Semiconductor and Opal-Metal Nanocomposites
MEMS DEVICE AND RELIABILITY PHYSICS
Pull-in Dynamics of Electrostatically Actuated Bistable Micro Beams
Path Following and Numerical Continuation Methods for Non-Linear MEMS and NEMS
The Impact of Dielectric Material and Temperature on Dielectric Charging in RF MEMS Capacitive Switches
ADVANCED PROCESSES AND MATERIALS
Development of DRIE for the Next Generation of MEMS Devices
Low-Temperature Processes for MEMS Device Fabrication
High-Temperature Stable Au–Sn and Cu–Sn Interconnects for 3D Stacked Applications
3D Integration of MEMS and IC: Design, Technology and Simulations
Low-Frequency Electronic Noise in the Back-Gated and Top-Gated Graphene Devices
Modeling of Dry Etching in Production of MEMS
XRD and Raman Study of Low Temperature AlGaAs/GaAs (100) Heterostructures
Internal Stresses in Martensite Formation in Copper Based Shape Memory Alloys
SENSORS
Smart Sensors: Advantages and Pitfalls
Vertically Integrated MEMS SOI Composite Porous Silicon-Crystalline Silicon Cantilever-Array Sensors: Concept for Continuous Sensing of Explosives and Warfare Agents
Integration of Diverse Biological Materials in Micro/Nano Devices
Force Sensing Optimization and Applications
Using Parametric Resonance to Improve Micro Gyrsocope Robustness |
Advanced materials and technologies for micro/nano-devices, sensors and actuators [texte imprimé] / Evgeni Gusev, Auteur ; Eric Garfunkel, Auteur ; Arthur Dideikin, Auteur . - Dordrecht : Springer, 2010 . - 314 p. : couv. ill. en coul. ; 24 cm.. - ( NATO Science for Peace and Security Series) . ISBN : 978-90-481-3806-7 Langues : Anglais ( eng) | Catégories : | PHYSIQUE
| | Index. décimale : | 05-10 Physique des semi-conducteurs | | Résumé : | A NATO Advanced Research Workshop (ARW) entitled “Advanced Materials and Technologies for Micro/Nano Devices, Sensors and Actuators” was held in St. Petersburg, Russia, from June 29 to July 2, 2009. The main goal of the Workshop was to examine (at a fundamental level) the very complex scientific issues that pertain to the use of micro- and nano-electromechanical systems (MEMS and NEMS), devices and technologies in next generation commercial and defen- related applications. Micro- and nano-electromechanical systems represent rather broad and diverse technological areas, such as optical systems (micromirrors, waveguides, optical sensors, integrated subsystems), life sciences and lab equipment (micropumps, membranes, lab-on-chip, membranes, microfluidics), sensors (bio-sensors, chemical sensors, gas-phase sensors, sensors integrated with electronics) and RF applications for signal transmission (variable capacitors, tunable filters and antennas, switches, resonators). From a scientific viewpoint, this is a very multi-disciplinary field, including micro- and nano-mechanics (such as stresses in structural materials), electronic effects (e. g. charge transfer), general electrostatics, materials science, surface chemistry, interface science, (nano)tribology, and optics. It is obvious that in order to overcome the problems surrounding next-generation MEMS/NEMS devices and applications it is necessary to tackle them from different angles: theoreticians need to speak with mechanical engineers, and device engineers and modelers to listen to surface physicists. It was therefore one of the main objectives of the workshop to bring together a multidisciplinary team of distinguished researchers. | | Note de contenu : | Table of contents
MEMS/NEMS TECHNOLOGIES AND APPLICATIONS
History of Early Research on MEMS in Russia (U.S.S.R.)
Challenges of Complete CMOS/MEMS Systems Integration
MEMS for Practical Applications
Nanochip: A MEMS-Based Ultra-High Data Density Memory Device
Low Cost Silicon Coriolis’ Gyroscope Paves the Way to Consumer IMU
Microwave and Millimetre Wave Devices Based on Micromachining of III-V Semiconductors
Monocrystalline-Silicon Microwave MEMS Devices
Three-Dimensional Photonic Crystals Based on Opal-Semiconductor and Opal-Metal Nanocomposites
MEMS DEVICE AND RELIABILITY PHYSICS
Pull-in Dynamics of Electrostatically Actuated Bistable Micro Beams
Path Following and Numerical Continuation Methods for Non-Linear MEMS and NEMS
The Impact of Dielectric Material and Temperature on Dielectric Charging in RF MEMS Capacitive Switches
ADVANCED PROCESSES AND MATERIALS
Development of DRIE for the Next Generation of MEMS Devices
Low-Temperature Processes for MEMS Device Fabrication
High-Temperature Stable Au–Sn and Cu–Sn Interconnects for 3D Stacked Applications
3D Integration of MEMS and IC: Design, Technology and Simulations
Low-Frequency Electronic Noise in the Back-Gated and Top-Gated Graphene Devices
Modeling of Dry Etching in Production of MEMS
XRD and Raman Study of Low Temperature AlGaAs/GaAs (100) Heterostructures
Internal Stresses in Martensite Formation in Copper Based Shape Memory Alloys
SENSORS
Smart Sensors: Advantages and Pitfalls
Vertically Integrated MEMS SOI Composite Porous Silicon-Crystalline Silicon Cantilever-Array Sensors: Concept for Continuous Sensing of Explosives and Warfare Agents
Integration of Diverse Biological Materials in Micro/Nano Devices
Force Sensing Optimization and Applications
Using Parametric Resonance to Improve Micro Gyrsocope Robustness |
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